Dr. Tati Karliati, S.Hut., M.Si., and her colleagues investigated the upcycling process of thermoplastic WPS into thermosetting particleboard adhesive using two cross-linkers, namely MDI and MA. Rheology and Dynamic Mechanical Analysis revealed that modification with MDI and MA resulted in thermosetting properties in WPS-based adhesives by increasing the viscosity at a temperature above 72.7 °C and reaching the maximum storage modulus above 90.8 °C. WPS modified with MDI had a lower EA value (83.4 kJ/mole) compared to the WPS modified with MA 150.8 kJ/mole, indicating the cross-linking with MDI was much faster compared with MA. Particleboard fabricated from 100% sengon wood particles bonded with WPS modified with MDI fulfilled the minimum requirement of JIS A 5908:2003.

Article Citation:
Karliati, T.; Lubis, M.A.R.; Dungani, R.; Maulani, R.R.; Hadiyane, A.; Rumidatul, A.; Antov, P.; Savov, V.; Lee, S.H.. (2024). Performance of Particleboard Made of Agroforestry Residues Bonded with Thermosetting Adhesive Derived from Waste Styrofoam. Polymers. 16, 543. https://doi.org/10.3390/polym16040543